TITCS2305LoCostoULCGSM手机解决方案

LoCosto ULC的ULC架构采用65nm工艺,并采用芯片和系统级成本优化技术,能降低电子材料清单(eBOM)大约25%,降低PCB面积.ULC手机中新增的功能包括不需要外接另外的SRAM存储器的相对高分辨率的彩色显示器,高端全双工语音质量,接近CD质量的MP3和多音调振铃,更长的通话时间和待机时间,立体声FM无线电收音机,USB充电,免提工作,震动铃声以及支持其它的功能.

下图为TCS2315 LoCosto ULC GSM手机方框图.



LoCosto ULC Single Chip family: TIs third-generation GSM-based solutions for the Ultra Low-Cost (ULC) Handsets
Leveraging an advanced 65-nm process with TMS320C54x™ DSP and ARM7? cores in the same package, the TCS2305 GSM solution integrates TIs breakthrough digital RF DRP? technology to offer the most compelling user experience in Ultra Low-Cost (ULC) handsets. Part of the LoCosto ULC family, the TCS2305 enables handsets with high performance, robust functionality and innovative form factors in the most price-sensitive handsets. For example, the TCS2305 can implement the lowest cost color phones with a high degree of flexibility and scalability. Ideal for emerging markets such as India, China, Russia and Brazil where the next billion subscribers will come from, the TCS2305 LoCosto ULC GSM chipset can also be deployed in enhanced handsets for value-conscious segments in more mature markets.

The sustainable ULC structure of the LoCosto ULC family begins with the 65-nm process, but is extended by additional chip- and system-level cost-optimization techniques, including an approximate 25% reduction in the electronic bill of materials (eBOM), reduced PCB area caused by smaller chips and greater silicon integration and a cost-optimized PCB technology.

A set of enhanced capabilities are now possible in ULC handsets, such as a relatively high-resolution color display without requiring additional external SRAM, high-end full duplex voice quality, near CD-quality MP3 and polyphonic ringers, longer talk time and standby time, stereo FM radio connectivity, USB charging, handsfree speakerphone operation, vibration ringer, headset support and other functionality.

主要优势:

Enables Ultra Low-Cost (ULC) handsets targeted at emerging, fast-growing regions as well as established, cost-sensitive markets

Leverages 65-nm process with advanced DSP and ARM® technologies

TIs proven DRP technology featuring integrated digital RF, now shipping in volume on previous LoCosto solutions

Delivers a compelling next-generation user experience in ultra low-cost (ULC) handsets:

Lowest cost color handset because no additional external SRAM memory is needed to support up to 128 x 160, 65k color displays

Fast CPU processing for smooth user interface processing

CD-quality (44.1 kHz) MP3 ringers and polyphonic ringers

High-end full-duplex voice quality mitigates voice chopping and double talk

Improved loudness (up to twice as loud) for noisy environments and hands-free operation

FM connectivity with integrated stereo support

Ability to record FM for on-the-fly ringers

Optimized system design reduces component count and PCB board size compared to previous generations:

Up to 25% reduction in eBOM

Lower overall component count by 40%

Smaller modem block footprint by as much as 35% reduces PCB board size and enables innovative handset form factors and larger batteries

Lower power consumption for 30% longer talk time and 60 percent longer standby time

USB charging for universal and easy charger access

Flexibility for cost-sensitive and enhanced ULC handsets

Hardware-based M-Shield? technology for robust SIMLock, IMEI, and software/data security to protect users, operators and device manufacturers

Scalable across regions, market segments, languages and subscriber types

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