TIBluetoothTechnology(5.0)

Bluetooth Technology: BlueLink 5.0 Platform: BRF6300



BlueLink 5.0 Platform (BRF6300) - Availability Disclaimer

Optimized for mobile terminals, the BlueLink 5.0 platform from Texas Instruments (TI) is a highly integrated, digital CMOS, single-chip solution supporting Bluetooth® Specification v2.0 and all software needed for Bluetooth operation. The BRF6300 BlueLink 5.0 single-chip solution is based on TIs prior generation BRF6150, leveraging and exceeding its capabilities to provide maximum Enhanced Data Rate (EDR) support, lowest power consumption in most Bluetooth scenarios and lowest cost and bill of materials (BOM).



Get Started Now: Download the following documents for more information:

Bluelink 5.0 Platform Product Bulletin (ti_bluelink_5_brf6300.pdf, 202 KB)
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BlueLink 5.0 Platform
TIs BRF6300 BlueLink 5.0 solution integrates the Bluetooth baseband, RF transceiver, ARM7TDMI®, memory (ROM and RAM) and power management on one chip. To speed manufacturers time to market for Bluetooth-enabled 2G, 2.5G and 3G mobile phones, the BlueLink 5.0 single chip uses TIs 90 nanometer (nm) advanced process manufacturing and DRP? (Digital RF Processor) technology to deliver the industrys:

Maximum Bluetooth performance: Full Bluetooth v2.0 + EDR support with maximum throughput of speeds up to 3Mbps.

Leading WLAN Coexistence: Improved coexistence and interoperability with WLAN through a shared antenna architecture and collaborative interface to TIs mobile WLAN solutions such as the WiLink? 4.0 mobile WLAN platform. TIs WLAN-Bluetooth Coexistence Solution was introduced in 2003 and is included in 18 mobile devices in the marketplace today.

Industrys lowest power consumption: 100uA during critical in-use Bluetooth scenarios such as page and inquiry scan, which is three times lower than current solutions.

Smallest size: A 30 percent die size reduction over current solutions, greatly reducing board-space for a complete Bluetooth system.

Low cost: TI is able to provide the lowest cost solution through a reduced bill of materials (BOM).