TIBluetoothTechnology(6.0)

Bluetooth Technology: BlueLink 6.0 Platform: BRF6350


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BlueLink 6.0 Platform (BRF6350) - Availability Disclaimer
As TIs fourth generation Bluetooth® single-chip, the BRF6350 is a digital CMOS solution that integrates a complete Bluetooth Specification v2.0+EDR system with an FM radio receiver on a single piece of silicon. TIs BRF6350 is a highly integrated device, including Bluetooth baseband, RF transceiver, ARM7TDMI®, memory (ROM and RAM), power management and an FM receiver.

Get Started Now: Download the following documents for more information:

Bluelink 6.0 Platform Product Bulletin (ti_bluelink_6_brf6350.pdf, 265 KB)
2006 Download

Key Benefits:

Industrys best-performing Bluetooth specification 2.0 + EDR and highest fidelity FM stereo and mono performance on a single chip

Integration of Bluetooth and FM in the same silicon provides 25 percent solution size savings compared to discrete solution
Proven Bluetooth-FM RF co-existence

Complete software stack support for Bluetooth and FM, enabling ease of design and quick time-to-market

On-chip power management adapted to cellular applications
Incorporates TIs Bluetooth and WLAN co-existence hardware and software solution, providing a collaborative interface with TIs mobile WLAN chipsets

Uses TIs DRP? technology and is manufactured using 90-nm CMOS to deliver smallest and lowest cost Bluetooth and FM single-chip solution

General Features:

Highly optimized for mobile terminals
Supports major cellular reference frequencies
Small PCB layout area: 45 mm2
McBSP compatible I/F
Low power consumption
Flexibility to be easily integrated into various host system

topologies:

The Bluetooth and FM interfaces could be separated from each other (e.g. separate host interface, separate digital audio)

The Bluetooth and FM interfaces could be shared (e.g. same host interface, same digital audio)

The two functions can work simultaneously
FM receives/scans/sends RDS information to host, while Bluetooth can be in any operational mode

Small package
3.88 x 3.52 x 0.62 Wafer Scale Package (WSP)
On-chip power management adapted to cellular applications
LDO support range: 1.7 V to 1.9 V
Direct connection to battery: 2.2 V to 5.4 V
Feeding from DC2DC
Power saving modes to minimize power consumption when Bluetooth and FM functions are not in use

Temperature detection and compensation mechanism ensures minimal variation in the RF performance over the whole temperature range

Complete reference designs with TIs TCS cellular chipsets and OMAP? applications processors for fast time-to-market

Fully embedded FM receiver (including synthesizer and VOC tank)