建立一个完整的制版notes需要包括那些内容呢？(已有部分)

3 the max bow and twist from a true plane shall not exceed 0.07 inch per inch
4 thieving is permitted on inner layers w.no more than 70% area coverage within pattern.do not place patterns closer than 0.15 to any circuitry. unplated hole or board edge. no outer layer thieving permitted
5 lamspec calls out thickness before plating
6 drill data origin is at 0/0
7 the two fiducial features for drill and visual alignment and all primary surface pads must meet the following tolerance
8 holes are to be drilled using std drill size.variations in diameter callouts are used to easily define groups of holes that are processed differently.ie depth drill vs filled etc.
9 plating requirements
electrolytic stress-free nickle under gold. plate all exposed copper surfaces with
nickel microinches
gold microinches
selective electrolytic stress-free nickel under gold.plate per supplied gmask artwork file with:
nickel microinches
gold microinches min
10 soldermask to be applied using
liquid photoimageable soldermask
green
11 board and component and markings
color : white
12 holes in drill chart are to be filled with a conductive