如下:PAD100CIR50D.pad
LAYERS regular pad thermal relief anti pad
BEGIN LAYER circle100 circle130 circle130
default internal circle100 circle130 circle130
end layer circle100 circle130 circle130
soldermask_top circle 106
soldermask_bottom circle 106
原来的2层板,要做4层板了,是不是适用呢?请大家指教.