[转帖]关于做PBGA封装时采用SMD还是NSMD的考虑

admin · 发表于 2012-9-9 12:21:50

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Two types of land patterns are used for surface mount packages:
(1) Solder mask defined (SMD) pads that have the solder
mask opening smaller than metal pad and (2) Non-solder
mask defined (NSMD) pads that have the metal pad smaller
than the solder mask opening.

[此贴子已经被作者于2008-12-23 9:58:08编辑过]

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