超级经典教材《PCB手册》PRINTED CIRCUITS HANDBOOK

PRINTED
CIRCUITS
HANDBOOK
Clyde F. Coombs, Jr. Editor-in-Chief

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DOI: 10.1036/0071467343

CONTENTS
Chapter 1. Legislation and Impact on Printed Circuits
Chapter 2. ELECTRONIC PACKAGING AND HIGH-DENSITY INTERCONNECTIVITY
Chapter 3. Semiconductor Packaging Technology
Chapter 4. Advanced Component Packaging
Chapter 5. Types of Printed Wiring Boards
Chapter 6. Introduction to Base Materials
Chapter 7. Base Material Components
Chapter 8. Properties of Base Materials
Chapter 9. Base Materials Performance Issues
Chapter 10. The Impact of Lead-Free Assembly on Base Materials
Chapter 11. Selecting Base Materials for Lead-Free Assembly Applications
Chapter 12. Laminate Qualification and Testing
Chapter 13. Physical Characteristics of the PCB
Chapter 14. The PCB Design Process
Chapter 15. Electrical and Mechanical Design Parameters
Chapter 16. Current Carrying Capacity in Printed Circuits
Chapter 17. PCB Design for Thermal Performance
Chapter 18. Information Formating and Exchange
Chapter 19. Planning for Design, Fabrication, and Assembly
Chapter 20. Manufacturing Information, Documentation,and Transfer Including CAM Tooling for Fab and Assembly
Chapter 21. Embedded Components
Chapter 22. Introduction to High-Density Interconnection (HDI) Technology
Chapter 23. Advanced High-Density Interconnection (HDI) Technologies
Chapter 24. Drilling Processes
Chapter 25. Precision Interconnect Drilling
Chapter 26. Imaging
Chapter 27. Multilayer Materials and Processing
Chapter 28. Preparing Boards for Plating
Chapter 29. Electroplating
Chapter 30. Direct Plating
Chapter 31. PWB Manufacture Using Fully Electroless Copper
Chapter 32. Printed Circuit Board Surface Finishes
Chapter 33. Solder Mask
Chapter 34. Etching Process and Technologies
Chapter 35. Machining and Routing
Chapter 36. Bare Board Test Objectives and Definitions
Chapter 37. Bare Board Test Methods
Chapter 38. Bare Board Test Equipment
Chapter 39. HDI Bare Board Special Testing Methods
Chapter 40. Assembly Processes
Chapter 41. Conformal Coating
Chapter 42. Solderability: Incoming Inspection and Wet Balance Technique
Chapter 43. Fluxes and Cleaning
Chapter 44. Soldering Fundamentals
Chapter 45. Soldering Materials and Metallurgy
Chapter 46. Solder Fluxes
Chapter 47. Soldering Techniques
Chapter 48. Soldering Repair and Rework
Chapter 49. Press-Fit Interconnection
Chapter 50. Land Grid Array Interconnect
Chapter 51. Acceptability and Quality of Fabricated Boards
Chapter 52. Acceptability of Printed Circuit Board Assemblies
Chapter 53. Assembly Inspection
Chapter 54. Design for Testing
Chapter 55. Loaded Board Testing
Chapter 56. Conductive Anodic Filament Formation
Chapter 57. Reliability of Printed Circuit Assemblies
Chapter 58. Component-to-PWB Reliability: The Impact of Design
Variables and Lead Free
Chapter 59. Component-to-PWB Reliability: Estimating Solder-Joint
Reliability and the Impact of Lead-Free Solders
Chapter 60. Process Waste Minimization and Treatment
Chapter 61. Flexible Circuit Applications and Materials
Chapter 62. Design of Flexible Circuits
Chapter 63. Manufacturing of Flexible Circuits
Chapter 64. Termination of Flexible Circuits
Chapter 65. Multilayer Flex and Rigid/Flex
Chapter 66. Special Constructions of Flexible Circuits
Chapter 67. Quality Assurance of Flexible Circuits
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