IPC-4553-2005 印制电路板用浸银电镀规范

IPC-4553
Specification for
Immersion Silver Plating
for Printed Circuit Boards
Users of this publication are encouraged to participate in the
development of future revisions.


1 SCOPE
1.1 Statement of Scope This specification sets the
requirements for the use of Immersion Silver (IAg) as a
surface finish for printed circuit boards. This specification
is intended to set requirements for IAg deposit thickness
based on performance criteria. It is intended for use by
supplier, printed circuit manufacturer, electronics manufacturing
services (EMS) and original equipment manufacturer
(OEM).
1.2 Description IAg is a thin immersion deposit over
copper. It is a multifunctional surface finish, applicable to
soldering, press fit connections and as a contact surface. It
has the potential to be suitable for aluminum wire bonding.
The immersion silver protects the underlying copper from
oxidation over its intended shelf life. Exposure to moisture
and air contaminants, such as sulfur and chlorine, may
negatively impact the useful life of the deposit. The impact
can range from a slight discoloration of the deposit to the
pads turning completely black. Proper packaging is a
requirement.
IPC-4553-2005 印制电路板用浸银电镀规范.pdf