表面处理 | |||
Surface Treatment | |||
喷锡(含无铅)厚度 | |||
HASL(LF) | |||
沉锡/Immersion Tin | |||
沉金/Immersion Gold | |||
沉银/Immersion Silver | |||
抗氧化/OSP | |||
电金/Flash Gold | |||
板料/Laminates | |||
最大层数/MAX.Layers | |||
最大版面尺寸/MAX.Board Size | |||
板厚/Board Thickness | |||
最大铜厚 | |||
Max.Copper Thickness | |||
最小线宽/Min.Track Width | |||
最小线隙/Min.Track Space | |||
最小钻孔孔径/M.in Hole Size | |||
最小激光钻孔孔径/ | |||
M.in Laser Hole Size | |||
最小孔壁铜厚/ | |||
PTH Wall Thickness | |||
孔径公差/PTH Dia.Tolerance | |||
板厚与孔径比/Aspect Ratio | |||
阻抗控制/lmpedance Control |
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